[Technical Principles]
With the increasing complexity, thickness, and path density of PCB boards, as well as the decreasing aperture and path width, traditional DC electroplating has become increasingly ineffective. DC electroplating technology is difficult to provide high-speed electroplating and average electroplating distribution for these products. If this is due to the distribution and aggregation of copper ions along the edge of the hole, which is in the high current density field, rather than in the center part of the hole, which is in the low current density field, this results in more distribution of copper along the edge of the hole than in the center part of the hole. The positive and negative pulse power supply regulates the aggregation and distribution of copper ions in the high and low current Li degree fields through the action of pulses.